JPH02128374U - - Google Patents
Info
- Publication number
- JPH02128374U JPH02128374U JP3558589U JP3558589U JPH02128374U JP H02128374 U JPH02128374 U JP H02128374U JP 3558589 U JP3558589 U JP 3558589U JP 3558589 U JP3558589 U JP 3558589U JP H02128374 U JPH02128374 U JP H02128374U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- wiring conductor
- overlapping area
- wiring
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3558589U JPH02128374U (en]) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3558589U JPH02128374U (en]) | 1989-03-30 | 1989-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02128374U true JPH02128374U (en]) | 1990-10-23 |
Family
ID=31541067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3558589U Pending JPH02128374U (en]) | 1989-03-30 | 1989-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02128374U (en]) |
-
1989
- 1989-03-30 JP JP3558589U patent/JPH02128374U/ja active Pending